Total: 48
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
128Mb(16M x 8)
2.7V ~ 3.6V
1.7V ~ 2V
1.65V ~ 3.6V
SPI - Four I/O
1.65V ~ 2V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
50 MHz
108 MHz
133 MHz
54 MHz
66 MHz
104 MHz
120 MHz
8ms,2.8ms
8ms,5ms
15ms,5ms
15ms,7ms
23-UFBGA,WLCSP
24-TBGA
8-SOIC(0.209,5.30mm wide)
8-VDFN Exposed Pad
8-WDFN Exposed Pad
15-XFBGA,WLCSP
16-SOIC(0.295,7.50mm wide)
56-TFSOP(0.724,18.40mm wide)
64-LBGA