Total: 47
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
128Mb(16M x 8)
2.7V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
108 MHz
133 MHz
66 MHz
80 MHz
104 MHz
8ms,2.8ms
8ms,5ms
3ms
16-SOIC(0.295,7.50mm wide)