Total: 83
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT
pipe
bulk,pallet
128Mb(16M x 8)
2.7V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
1.65V ~ 2V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-25°C ~ 85°C(TA)
120 MHz
75 MHz
133 MHz
104 MHz
70ns
90ns
110ns
8-SOIC(0.209 ,5.30mm wide)
16-SOIC(0.295 ,7.50mm wide)
24-TBGA,CSPBGA
56-TFSOP(0.724 ,18.40mm wide)
64-LBGA,CSPBGA
16-UFBGA,WLCSP
23-UFBGA,WLCSP
8-WDFN Exposed Pad
56-TFBGA,CSPBGA