Total: 13
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
128Mb(32M x 4)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
108 MHz
8ms,5ms
24-TBGA
8-VDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)