Total: 4
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
128Mb(8M x 16)
1.7V ~ 1.9V
3V ~ 3.6V
2.3V ~ 2.7V
-40°C ~ 85°C(TA)
-40°C ~ 95°C(TC)
0°C ~ 70°C(TA)
200 MHz
15ns
84-TFBGA
54-TSOP(0.400,10.16mm wide)
66-TSSOP (szerokość 0,400,10,16mm)