Total: 11
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
256Mb(32M x 8,16M x 16)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
60ns
70ns
95ns
56-TFSOP(0.724,18.40mm wide)
64-LBGA
64-TBGA
56-VFBGA