Total: 14
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
2Mb(256k x 8)
SPI - Four I/O
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
104 MHz
30µs,800µs
8-SOIC(0.154,3.90mm wide)
8-UFDFN Exposed Pad
8-XFDFN Exposed Pad