Total: 9
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
32Mb(8M x 4)
2.7V ~ 3.6V
1.7V ~ 2V
SPI - Four I/O
2.65V ~ 3.6V
-40°C ~ 85°C(TA)
-40°C ~ 125°C(TA)
108 MHz
133 MHz
8ms,5ms
8-UDFN
24-TBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-VDFN Exposed Pad
8-UDFN Exposed Pad