Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
32Mb(8M x 4)
SPI - Four I/O
2.65V ~ 3.6V
-40°C ~ 85°C(TA)
133 MHz
8-SOIC(0.154 ,3.90mm wide)
8-WDFN Exposed Pad