Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT
64Mb(16M x 4)
1.7V ~ 2V
-40°C ~ 85°C(TA)
-40°C ~ 125°C(TA)
108 MHz
8ms,5ms
8-SOIC(0.154,3.90mm wide)