Total: 498
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk
pallet
TR
TR,CT
CT
pipe
bulk,pallet
pallet,pallet
TR,TR,CT
bulk,pallet,pallet
64Mb(8M x 8)
1.7V ~ 1.95V
2.7V ~ 3.6V
1.7V ~ 2V
2.3V ~ 3.6V
1.65V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
1.65V ~ 2V
2.65V ~ 3.6V
1.65V ~ 1.95V
-40°C ~ 85°C
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
-40°C ~ 85°C(TC)
86 MHz
120 MHz
200 MHz
166 MHz
50 MHz
75 MHz
108 MHz
133 MHz
80 MHz
104 MHz
70ns
90ns
15ms,5ms
3ms
8-SOIC(0.209 ,5.30mm wide)
8-SOIC(0.154 ,3.90mm wide)
16-SOIC(0.295 ,7.50mm wide)
48-TFSOP(0.724 ,18.40mm wide)
32-TFSOP(0.724 ,18.40mm wide)
24-TBGA,CSPBGA
56-TFSOP(0.724 ,18.40mm wide)
64-LBGA,CSPBGA
48-LFBGA,CSPBGA
12-UFBGA,WLCSP
14-XFBGA,WLCSP
22-UFBGA,WLCSP
5ms
60µs,5ms
24-TBGA
48-TFSOP(0.724,18.40mm wide)
mould
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-VDFN Exposed Pad
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-UDFN Exposed Pad
8-UFDFN Exposed Pad
8-DIP(0.300,7.62mm)
8-XDFN Exposed Pad
8-WFDFN Exposed Pad
8-SOIC
8-DIP(0.260,6.60mm)
8-WLGA
0404