Total: 55
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
pipe
64Mb(8M x 8)
1.7V ~ 1.95V
2.7V ~ 3.6V
SPI - Four I/O,QPI
1.65V ~ 2V
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
133 MHz
104 MHz
3ms
8-SOIC(0.209 ,5.30mm wide)
14-XFBGA,WLCSP
5ms
60µs,5ms
24-TBGA
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-XDFN Exposed Pad