Total: 46
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
64Mb(8M x 8)
2.7V ~ 3.6V
1.65V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
1.65V ~ 2V
2.65V ~ 3.6V
-40°C ~ 85°C(TA)
86 MHz
133 MHz
80 MHz
104 MHz
70ns
90ns
48-TFSOP(0.724 ,18.40mm wide)
24-TBGA,CSPBGA
56-TFSOP(0.724 ,18.40mm wide)
64-LBGA,CSPBGA
48-LFBGA,CSPBGA
24-TBGA
8-WDFN Exposed Pad
8-UDFN Exposed Pad