Total: 17
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
pipe
512Mb(64M x 8)
2.7V ~ 3.6V
1.7V ~ 2V
SPI - Four I/O,QPI,DTR
1.65V ~ 2V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
200 MHz
166 MHz
133 MHz
16-SOIC(0.295 ,7.50mm wide)
24-TBGA
8-WDFN Exposed Pad