Total: 7
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT,
2Gb(256M x 8)
1.7V ~ 1.95V
3V ~ 3.6V
SPI - Four I/O,QPI,DTR
1.65V ~ 2V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
166 MHz
133 MHz
24-LBGA,CSPBGA
3.5ms
24-TBGA
16-SOIC(0.295,7.50mm wide)