Total: 6
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT,
1Gb(128M x 8)
2Gb(256M x 8)
2.7V ~ 3.6V
3V ~ 3.6V
SPI - Four I/O,QPI,DTR
-40°C ~ 85°C(TA)
133 MHz
3.5ms
24-TBGA
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)