Total: 4
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
16Mb(2M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
2.7V ~ 3.6V
SPI - Four I/O,QPI,DTR
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
133 MHz
3ms
8-SOIC(0.209,5.30mm wide)