Total: 4
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
2Gb(256M x 8)
1.7V ~ 1.95V
2.7V ~ 3.6V
SPI - Four I/O,DTR
-40°C ~ 85°C(TA)
166 MHz
24-TBGA
16-SOIC(0.295,7.50mm wide)