Total: 24
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
256Mb(32M x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
64Mb(8M x 8)
SPI - Four I/O
SPI - Four I/O,QPI
1.65V ~ 2V
-40°C ~ 85°C(TA)
108 MHz
133 MHz
80 MHz
104 MHz
120 MHz
8-SOIC(0.154 ,3.90mm wide)
8-XFBGA,WLCSP
23-UFBGA,WLCSP
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
8-UDFN Exposed Pad
8-UFDFN Exposed Pad
10-XFBGA,WLCSP