Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
512Mb(64M x 8)
SPI - Four I/O,DTR
1.65V ~ 2V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
200 MHz
68-XFBGA,WLCSP
24-TBGA