Total: 14
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT
pipe
256Mb(32M x 8)
512Mb(64M x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
SPI - Four I/O
1.65V ~ 2V
-40°C ~ 85°C(TA)
108 MHz
8-SOIC(0.209 ,5.30mm wide)
8-SOIC(0.154 ,3.90mm wide)
16-SOIC(0.295 ,7.50mm wide)
31-UFBGA,WLCSP
24-TBGA
8-WDFN Exposed Pad
8-UFDFN Exposed Pad