Total: 9
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
pipe
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
512Kb(64K x 8)
2.35V ~ 3.6V
-40°C ~ 85°C(TA)
50 MHz
75 MHz
15ms,5ms
8-SOIC(0.154 ,3.90mm wide)
8-WDFN Exposed Pad
8-UFDFN Exposed Pad