Total: 28
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT
pipe
256Mb(32M x 8)
32Mb(8M x 4)
64Mb(16M x 4)
64Mb(8M x 8)
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
2.65V ~ 3.6V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
120 MHz
133 MHz
8-SOIC(0.209 ,5.30mm wide)
8-SOIC(0.154 ,3.90mm wide)
16-SOIC(0.295 ,7.50mm wide)
24-TBGA,CSPBGA
24-TBGA
8-WDFN Exposed Pad
8-UDFN Exposed Pad