Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
2Mb(256K x 8)
SPI - Four I/O
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
104 MHz
800µs
8-SOIC(0.154,3.90mm wide)
8-WDFN Exposed Pad
8-UFDFN Exposed Pad