Total: 32
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
16Mb(2M x 8)
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
133 MHz
104 MHz
3ms
8-UFBGA,WLCSP
63-VFBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-UFDFN Exposed Pad
8-XFDFN Exposed Pad