Total: 1
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
16Mb(2M x 8)
SPI - Four I/O
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
133 MHz
3ms
8-SOIC(0.209,5.30mm wide)