Total: 326
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
pipe
bulk,pallet
pallet,pallet
TR,CT,
CT,
TR,TR
256Mb(16M x 16)
256Mb(32M x 8)
512Mb(64M x 8)
1Gb(64M x 16)
1Gb(128M x 8)
2Gb(128M x 16)
2Gb(256M x 8)
4Gb(512M x 8)
2Gb(256M x 8)(NAND),1G(32M x 32)(LPDDR2)
2Gb(256M x 8)(NAND),2G(64M x 32)(LPDDR2)
4Gb(256M x 16)
4Gb(512M x 8)(NAND),2G(64M x 32)(LPDDR2)
32Mb(2M x 16)
32Mb(4M x 8)
64Mb(4M x 16)
128Mb(16M x 8)
128Mb(8M x 16)
64Mb(8M x 8)
256Mb(16M x 16),512M(32M x 16)
1Gb(32M x 32)
512Mb(16M x 32)
1Gb(NAND),512Mb(LPDDR2)
512Mb Flash Memory,64Mb RAM
256Mb Flash Memory,256Mb DDR DRAM
256Mb Flash Memory,64Mb RAM
128Mb Flash Memory,64Mb RAM
1.7V ~ 1.95V
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
SPI - Four I/O,DTR
ONFI
-40°C ~ 85°C
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 105°C(TC)
-25°C ~ 85°C(TA)
-40°C ~ 125°C(TA)
-40°C ~ 85°C(TC)
-30°C ~ 85°C(TA)
-25°C ~ 85°C(TC)
200 MHz
533 MHz
100 MHz
166 MHz
52 MHz
108 MHz
133 MHz
54 MHz
66 MHz
80 MHz
104 MHz
22 ns
15ns
25ns
60ns
45ns
3ms
48-TFSOP(0.724 ,18.40mm wide)
12-UFBGA,WLCSP
5ms
35ns
60-TFBGA
84-TFBGA
24-TBGA
48-TFSOP(0.724,18.40mm wide)
63-VFBGA
121-WFBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-UFDFN Exposed Pad
44-VFBGA
48-VFBGA
56-TFBGA,CSPBGA
56-VFBGA
133-VFBGA
54-VFBGA
32-UFBGA,WLCSP
90-TFBGA
54-TFBGA
84-VFBGA
8-XDFN Exposed Pad
21-UFBGA,WLCSP
21-XFBGA,WLCSP
48-UFBGA,WLCSP
24-VBGA
44-FBGA(7.5x5)