Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
128Mb(16M x 8)
1.7V ~ 1.95V
SPI - Four I/O
-40°C ~ 85°C
-40°C ~ 85°C(TA)
133 MHz
104 MHz
3ms
8-SOIC(0.209,5.30mm wide)