Total: 38
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
pipe
bulk,pallet
256Mb(32M x 8)
512Mb(64M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
64Mb(8M x 8)
512Mb Flash Memory,64Mb RAM
1.7V ~ 1.95V
SPI - Four I/O
SPI - Four I/O,QPI,DTR
-40°C ~ 105°C(TA)
100 MHz
166 MHz
133 MHz
3ms
5ms
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
8-XDFN Exposed Pad
24-VBGA