Total: 45
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
bulk,pallet
256Mb(32M x 8)
512Mb(64M x 8)
1Gb(128M x 8)
2Gb(256M x 8)
128Mb(16M x 8)
512Mb Flash Memory,64Mb RAM
1.7V ~ 1.95V
SPI - Four I/O,QPI,DTR
SPI - Four I/O,DTR
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
166 MHz
24-TBGA
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
24-VBGA