Total: 19
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
pipe
128Mb(16M x 8)
1.7V ~ 1.95V
SPI - Four I/O
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
133 MHz
3ms
24-TBGA
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
21-UFBGA,WLCSP
21-XFBGA,WLCSP