Total: 36
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(16M x 16)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
0°C ~ 85°C(TA)
56-TFSOP(0.724,18.40mm wide)
64-LBGA
56-VFBGA
64-FBGA(13x11)