Total: 239
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk
pallet
TR
TR,CT
CT
pipe
pallet,pallet
TR,CT,
16Mb(2M x 8)
2.7V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI,DTR
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
86 MHz
50 MHz
75 MHz
108 MHz
133 MHz
80 MHz
104 MHz
120 MHz
65 MHz
70ns
90ns
15ms,5ms
3ms
15ms,3ms
8-SOIC(0.209 ,5.30mm wide)
8-SOIC(0.154 ,3.90mm wide)
16-SOIC(0.295 ,7.50mm wide)
48-TFSOP(0.724 ,18.40mm wide)
48-LFBGA,CSPBGA
8-XFBGA,WLCSP
48-TFBGA,CSPBGA
48-WFBGA,CSPBGA
7ms
24-TBGA
mould
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-VDFN Exposed Pad
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-UDFN Exposed Pad
8-UFDFN Exposed Pad
8-DIP(0.300,7.62mm)
8-XFDFN Exposed Pad
8-XDFN Exposed Pad