Total: 47
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
128Mb(16M x 8)
2.7V ~ 3.6V
SPI - Four I/O,QPI
-40°C ~ 85°C(TA)
120 MHz
133 MHz
104 MHz
70ns
90ns
110ns
24-TBGA,CSPBGA
56-TFSOP(0.724 ,18.40mm wide)
64-LBGA,CSPBGA
8-WDFN Exposed Pad
56-TFBGA,CSPBGA