Total: 800
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT
pipe
TR,CT,
256Mb(32M x 8)
512Mb(32M x 16)
512Mb(64M x 8)
1Gb(128M x 8)
2Gb(256M x 8)
4Gb(512M x 8)
1Mb(128K x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
32Mb(4M x 8,2M x 16)
128Mb(16M x 8)
128Mb(16M x 8,8M x 16)
64Mb(8M x 8)
16Mb(FLASH-NOR),1Gb(FLASH-NAND)(2M x 8(FLASH-NOR),128M x 8(FLASH-NAND))
32Mb(FLASH-NOR),1Gb(FLASH-NAND)(4M x 8(FLASH-NOR),128M x 8(FLASH-NAND))
2.7V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
ONFI
-40°C ~ 85°C
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
-20°C ~ 85°C(TA)
100 MHz
166 MHz
40 MHz
50 MHz
75 MHz
133 MHz
80 MHz
104 MHz
25ns
70ns
90ns
15ms,5ms
3ms
8-XFBGA,WLCSP
800µs
3.5ms
5ms
250µs
7ms
24-TBGA
48-TFSOP(0.724,18.40mm wide)
63-VFBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
48-TFBGA
56-TFSOP(0.724,18.40mm wide)
64-LBGA
8-UDFN Exposed Pad
8-UFDFN Exposed Pad
8-DIP(0.300,7.62mm)
8-WLGA Exposed Pad
8-XFDFN Exposed Pad
8-XDFN Exposed Pad