Total: 8
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
512Mb(64M x 8)
1Gb(128M x 8)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
166 MHz
24-TBGA
16-SOIC(0.295,7.50mm wide)
24-VBGA