Total: 44
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
256Mb(16M x 16)
256Mb(32M x 8)
512Mb(32M x 16)
512Mb(64M x 8)
1Gb(128M x 8)
64Mb(4M x 16)
128Mb(16M x 8)
128Mb(32M x 4)
128Mb(8M x 16)
16Mb(4M x 4)
32Mb(8M x 4)
64Mb(16M x 4)
1.7V ~ 2V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 85°C(TC)
166 MHz
40 MHz
52 MHz
108 MHz
133 MHz
80 MHz
85ns
95ns
8ms,2.8ms
8ms,5ms
65ns
8ms,1ms
24-TBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-VDFN Exposed Pad
8-WDFN Exposed Pad
15-XFBGA,WLCSP
16-SOIC(0.295,7.50mm wide)
23-XFBGA,WLBGA
56-TFSOP(0.724,18.40mm wide)
64-LBGA
64-TBGA
8-XFBGA,CSPBGA
80-LBGA