Total: 15
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk,pallet
256Mb(32M x 8)
512Mb(64M x 8)
1Gb(128M x 8)
128Mb(16M x 8)
64Mb(8M x 8)
1.7V ~ 2V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
133 MHz
80 MHz
8ms,2.8ms
24-TBGA
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
8-WLGA