Total: 49
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
256Mb(16M x 16)
512Mb(64M x 8)
1Mb(128K x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
64Mb(4M x 16)
128Mb(8M x 16)
512Kb(64K x 8)
2.3V ~ 3.6V
SPI - Four I/O
SPI - two I/O
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C
-40°C ~ 85°C(TC)
50 MHz
52 MHz
75 MHz
108 MHz
133 MHz
80 MHz
104 MHz
85ns
15ms,5ms
8-SOIC(0.154 ,3.90mm wide)
24-TBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-VDFN Exposed Pad
8-WDFN Exposed Pad
64-TBGA
8-UFDFN Exposed Pad
8-XFDFN Exposed Pad