Total: 8
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT
pipe
512Mb(64M x 8)
2.3V ~ 3.6V
-40°C ~ 105°C(TA)
133 MHz
24-TBGA
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)