Total: 43
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT
pipe
1Mb(128K x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
2.3V ~ 3.6V
SPI - two I/O
-40°C ~ 85°C(TA)
-40°C ~ 125°C(TA)
75 MHz
15ms,5ms
24-TBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-VDFN Exposed Pad
8-UDFN Exposed Pad
8-UFDFN Exposed Pad