Total: 232
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk
pallet
TR
TR,CT
pipe
pallet,pallet
TR,CT,
TR,TR
256Mb(16M x 16)
256Mb(32M x 8)
512Mb(32M x 16)
1Gb(128M x 8)
2Gb(256M x 8)
4Mb(512K x 8)
4Mb(512K x 8,256K x 16)
8Mb(1M x 8)
8Mb(1M x 8,512K x 16)
16Mb(2M x 8)
16Mb(2M x 8,1M x 16)
64Mb(4M x 16)
128Mb(16M x 8)
128Mb(16M x 8,8M x 16)
128Mb(8M x 16)
256Mb(32M x 8,16M x 16)
512Mb(64M x 8,32M x 16)
16Mb(1M x 16)
2Gb(256M x 8,128M x 16)
128Mb(4M x 32)
64Mb(2M x 32)
3V ~ 3.6V
SPI - Four I/O,QPI,DTR
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
0°C ~ 70°C(TA)
-40°C ~ 125°C(TA)
-40°C ~ 85°C(TC)
-20°C ~ 85°C(TA)
0°C ~ 85°C(TA)
200 MHz
166 MHz
133 MHz
33 MHz
143 MHz
80ns
90ns
3.5ms
35ns
36ns
60-TFBGA
24-TBGA
48-TFSOP(0.724,18.40mm wide)
32-LCC(J feedthrough)
40-TFSOP(0.724,18.40mm wide)
44-SOIC(0.496,12.60mm wide)
56-TFSOP(0.724,18.40mm wide)
64-LBGA
32-TFSOP(0.488,12.40mm wide)
48-VFBGA
54-TSOP(0.400,10.16mm wide)
86-TFSOP(0.400,10.16mm wide)
90-TFBGA
54-TFBGA
50-TSOP(0.400,10.16mm wide)
56-TSOP