Total: 16
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk
4Mb(512K x 8,256K x 16)
8Mb(1M x 8)
4.5V ~ 5.5V
-40°C ~ 85°C(TA)
0°C ~ 70°C(TA)
80ns
48-TFSOP(0.724,18.40mm wide)
40-TFSOP(0.724,18.40mm wide)
44-SOIC(0.496,12.60mm wide)