Total: 16
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
4.5V ~ 5.5V
-40°C ~ 85°C(TA)
70ns
90ns
48-TFSOP(0.724 ,18.40mm wide)
32-TFSOP(0.724 ,18.40mm wide)
44-SOIC(0.496 ,12.60mm wide)
32-LCC(J feedthrough)