Total: 20
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
1Gb(64M x 16)
1Mb(128K x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
128Mb(16M x 8)
128Mb(8M x 16)
512Kb(64K x 8)
1.65V ~ 3.6V
SPI - Four I/O
-40°C ~ 85°C(TA)
100 MHz
108 MHz
33 MHz
80 MHz
8-SOIC(0.154,3.90mm wide)
56-TFSOP(0.724,18.40mm wide)
64-LBGA
8-UFDFN Exposed Pad
8-XFDFN Exposed Pad