Total: 11
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
16Mb(2M x 8)
2.7V ~ 3.6V
2.3V ~ 3.6V
1.65V ~ 3.6V
SPI - Four I/O
1.65V ~ 2V
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
-40°C ~ 125°C(TA)
133 MHz
80 MHz
104 MHz
3ms
8-SOIC(0.154,3.90mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)