Total: 24
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT
pipe
2Mb(256K x 8)
2.3V ~ 3.6V
1.65V ~ 3.6V
SPI - Four I/O
1.65V ~ 2V
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
108 MHz
33 MHz
80 MHz
104 MHz
8-SOIC(0.154 ,3.90mm wide)
8-UFBGA,WLCSP
8-TSSOP(0.173 ,4.40mm wide)
800µs
8-SOIC(0.154,3.90mm wide)
8-WDFN Exposed Pad
8-UDFN Exposed Pad
8-UFDFN Exposed Pad