Total: 6
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
16Mb(2M x 8)
32Mb(4M x 8)
64Mb(8M x 8)
1.7V ~ 1.95V
2.7V ~ 3.6V
SPI - Four I/O
-40°C ~ 85°C(TA)
133 MHz
3ms
5ms
8-XDFN Exposed Pad