Total: 7
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
16Mb(2M x 8)
32Mb(4M x 8)
64Mb(8M x 8)
1.7V ~ 1.95V
1.65V ~ 3.6V
SPI - Four I/O
1.65V ~ 2V
-40°C ~ 85°C(TA)
133 MHz
33 MHz
80 MHz
104 MHz
3ms
12-UFBGA,WLCSP
5ms