Total: 21
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
256Mb(32M x 8)
1Gb(128M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
64Mb(8M x 8)
1.7V ~ 1.95V
2.7V ~ 3.6V
SPI - Four I/O,QPI
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
133 MHz
104 MHz
3ms
5ms
60µs,5ms
16-SOIC(0.295,7.50mm wide)